Enxense's HPXD EDXRF detector module

Naked ASIC in test-setup

HPXD: 2D sensor flip-chip bonded on ASIC

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Enxense is presenting a patented novel X-ray spectroscopy & imaging technology with features like:

  • Extremely high count rate per square mm
  • Upholding the count rate per square mm independent of detection area
  • Upholding the energy-resolution independent of detection area
  • Lean cooling requirements
  • Suitable for sensor material made of both Silicon and CdTe/CZT
  • Potential for full-field XRF imaging
  • Potential for one-piece large surface detectors, 400mm2 and above
  • Potential for use as XRD/XRF combined detector